Vapor Phase Reflow Soldering System has compact footprint. In addition to 3-step profiling with principle of injection (5 with void reducing vacuum), CondensoXS vapor phase condensation reflow soldering system offers horizontal transport of assembled board to prevent components from slipping. Use of injection principle and control of temperature and pressure (vacuum) allow precise and diverse reflow profiling. Measuring complex requirements of lead-free ...
June 18, 2013 - ThomasNet
Low-Profile 0603 Diplexer targets multiband applications. Based on multilayer organic high density interconnect technology, 0603 MLO™ diplexer (part No. DP03B5425TTR) measures 0.065 x 0.035 x 0.017 in. and supports multiple wireless standards: WCDMA, CDMA, WLAN, GSM, and BT. Expansion matched to PCBs promotes reliability, and available finishes of Ni Au, Ni Sn, and OSP are compatible with automatic soldering technologies. Diplexers are suited for ...
June 13, 2013 - ThomasNet
Philippe Kahn in USA Today I had time to make a couple trips to RadioShack to get soldering wire,Kahn says. "I just stayed in the room and made that thing work."